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Zirconium Sputtering Target Zirconium Sputtering Target Zirconium Sputtering Target Zirconium Sputtering Target

Zirconium Sputtering Target

  • High purity Zr up to 99.95% (3N5) for stable film performance
  • Low hafnium grades available: Hf ≤ 250ppm (0.025%) or Hf ≤ 500ppm
  • Density 6.52 g/cm³ with fine grain size (typically 40 μm) for uniform sputtering
  • Low neutron absorption cross-section — ideal for nuclear reactor component coatings
  • Strong oxygen affinity — produces high-quality ZrO₂ films for optical and insulating layers
  • Excellent corrosion resistance in acids, alkalis, and harsh environments
  • Available as planar, rotary, step, and custom-shaped targets
  • Target bonding services available: copper, aluminum, or titanium backing plates

Description Of Zirconium Sputtering Target

Zirconium Sputtering Target is a high-purity zirconium metal component used as the cathode in physical vapor deposition (PVD) processes. During sputtering or cathodic arc evaporation, the zirconium target is bombarded by energetic ions, causing zirconium atoms to be ejected and deposited onto a substrate to form a thin film.

Zirconium is a silver-grey transition metal with a density of 6.52 g/cm³ and a melting point of 1855°C. It has a very low neutron absorption cross-section, making it indispensable in the nuclear industry for reactor components and their coatings. Zirconium also has a strong affinity for oxygen, readily forming high-quality zirconium oxide (ZrO₂) films that are used in optical coatings and insulating layers.

Zirconium sputtering targets are typically manufactured from high-purity zirconium crystal bars or sponge through vacuum melting, forging, rolling, and precision machining. The most commonly used grades are Zr702 (R60702) and Zr705 (R60705), with typical purity levels ranging from 99.5% to 99.95%. Low-hafnium grades (Hf ≤ 250ppm or Hf ≤ 500ppm) are available for nuclear applications where hafnium must be strictly controlled.

Zirconium sputtering targets are available in various forms including planar targets, rotary targets, step targets, and custom shapes per customer drawings. They are widely used in semiconductor manufacturing (barrier layers, dielectric layers, electrode materials), optical device manufacturing (high-refractive-index films, anti-reflection coatings), hard coatings (ZrN wear-resistant coatings), decorative coatings, and nuclear industry applications. Target bonding services are available for copper, aluminum, or titanium backing plates.


Features Of Zirconium Sputtering Target

  • High Purity:Up to 99.95% (3N5), ensuring stable electrical and optical performance of deposited films.

  • Low Hafnium Grades Available: Hf ≤ 250ppm (0.025%) or Hf ≤ 500ppm, essential for nuclear applications.

  • Low Neutron Absorption Cross-Section: Critical for nuclear reactor components and fuel-related coatings.

  • Strong Oxygen Affinity: Produces high-quality ZrO₂ films for optical and insulating applications.

  • Excellent Corrosion Resistance: Resists acids, alkalis, salts, and most chemical media.

  • High Melting Point: 1855°C, maintaining stability under high-temperature processing conditions.

  • Fine Grain Size: Typically 40 μm, ensuring uniform sputtering and film thickness.

  • High Density: 6.50–6.52 g/cm³, minimizing porosity and ensuring consistent film quality.

  • Multiple Target Forms: Planar, rotary, step, rectangular, square, circular, tube, and custom shapes.

  • Bonding Services Available: Copper, aluminum, or titanium backing plates for improved thermal management.

  • Standard Compliance: ASTM B353, GB/T, ISO; ISO 9001 certified.


Specifications Of Zirconium Sputtering Target

ParameterSpecification
MaterialZirconium (Zr) metal
GradesZr702 (R60702), Zr704 (R60704), Zr705 (R60705), Zircaloy-2, Zircaloy-4
Purity99.5% – 99.95% (3N5)
Hafnium ContentLow Hf: ≤ 250ppm (0.025%); Standard: ≤ 500ppm
Density6.50 – 6.52 g/cm³
Melting Point1855°C
Grain SizeTypically 40 μm (fine grain available)
Oxygen Content≤ 200 ppm
Hydrogen Content≤ 3.5 ppm
Nitrogen Content≤ 5 ppm
Warpage≤ 0.1 mm
Surface RoughnessRa ≤ 32 microinch (machined)
Target FormsPlanar, rotary, step, rectangular, square, circular, tube, custom
Typical Diameters1", 2", 3", 4", 50mm, 60mm, 80mm, 100mm, custom
Backing PlateCopper, aluminum, or titanium (bonding service available)
Standard ComplianceASTM B353, ASTM B551, GB/T, ISO 9001
CertificationISO 9001

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