Beryllium Copper Plate | C17200 BeCu Alloy Plate Supplier
- High-strength beryllium copper plate in C17200 (Alloy 25)
- Manufactured to ASTM B194 standard
- UNS C17200 with 1.8–2.0% beryllium
- Excellent electrical conductivity (22–28% IACS) and thermal conductivity
- Superior strength and hardness after age hardening
- Outstanding corrosion resistance and fatigue resistance
- Non-magnetic and non-sparking properties
- Available in TD04 (cold rolled + aged), TF00 (solution annealed + aged), and custom tempers
Description Of Beryllium Copper Plate
Beryllium Copper Plate in C17200 (also known as Alloy 25) is a high-performance copper alloy plate manufactured to ASTM B194 standard. C17200 contains 1.8–2.0% beryllium with the balance being copper. This alloy offers an exceptional combination of high strength, excellent electrical and thermal conductivity, and outstanding corrosion resistance, making it the most widely used beryllium copper alloy.
C17200 beryllium copper achieves its high strength through precipitation hardening (age hardening). After solution annealing and aging, the alloy develops tensile strength up to 1,400 MPa and hardness up to 40 HRC, while maintaining electrical conductivity of 22–28% IACS. This unique combination of properties makes C17200 ideal for applications requiring both high strength and good conductivity, such as springs, electrical connectors, molds, and precision instruments.
Beryllium copper plates are available in a range of tempers including TD04 (cold rolled + aged) and TF00 (solution annealed + aged), with custom thicknesses, widths, and lengths available upon request. Typical applications include springs, connectors, switches, molds, and aerospace components.
Features Of Beryllium Copper Plate
High Strength: Tensile strength up to 1,400 MPa after age hardening.
High Hardness: Hardness up to 40 HRC after age hardening.
Excellent Electrical Conductivity: 22–28% IACS after age hardening.
Excellent Thermal Conductivity: 105–130 W/(m·K).
Outstanding Corrosion Resistance: Resists seawater, chlorides, and many chemicals.
Good Fatigue Resistance: Suitable for cyclic loading applications.
Non-Magnetic: Suitable for applications requiring non-magnetic properties.
Non-Sparking: Suitable for use in hazardous environments.
Multiple Tempers Available: TD04, TF00, and custom tempers.
Precautions Of Beryllium Copper Plate
Health Hazards: Beryllium copper contains beryllium, which is toxic. Inhalation of dust or fumes generated during machining, grinding, or welding can cause serious lung disease (berylliosis). Use in well-ventilated areas or fume hoods. Wear appropriate personal protective equipment (PPE), including gloves and respirators.
Machining Guidelines: Use sharp carbide tooling, adequate cooling, and appropriate cutting speeds. Avoid generating fine dust. Collect and dispose of machining chips properly.
Heat Treatment: Follow recommended solution annealing and aging procedures to achieve optimal properties. Avoid overheating, which can cause grain growth and reduced properties.
Handling and Storage: Handle with care to avoid surface contamination or mechanical damage. Store in a dry, clean environment.
Cleaning: Clean with a soft cloth or mild solvent. Avoid abrasive cleaners that could damage the surface.
Specifications Of Beryllium Copper Plate
| arameter | Specification |
|---|---|
| Material | Beryllium copper alloy |
| UNS Designation | C17200 (Alloy 25) |
| Standard | ASTM B194 |
| Beryllium Content | 1.80 – 2.00% |
| Density | 8.25 g/cm³ |
| Melting Point | 870°C |
| Tensile Strength | Up to 1,400 MPa (aged) |
| Yield Strength | Up to 1,200 MPa (aged) |
| Elongation | 1–10% (depending on temper) |
| Hardness | Up to 40 HRC (aged) |
| Electrical Conductivity | 22–28% IACS (aged) |
| Thermal Conductivity | 105–130 W/(m·K) |
| Thermal Expansion | 16.7 µm/(m·K) |
| Modulus of Elasticity | 128 GPa |

