High Purity Cobalt Sputtering Target
- High-purity cobalt sputtering target with 99.99% (4N) purity
- Excellent film uniformity and low particle generation
- High density and fine grain structure for stable sputtering
- Ideal for semiconductor interconnects and advanced packaging
- Suitable for magnetic thin films and electronic devices
- Custom sizes and shapes available per customer requirements
- Target bonding services available (copper or titanium backing plate)
Description Of High Purity Cobalt Sputtering Target
High Purity Cobalt Sputtering Target is a high-purity cobalt target manufactured from 99.99% (4N) pure cobalt, specifically designed for physical vapor deposition (PVD) processes in semiconductor, electronics, and magnetic thin film applications. Cobalt targets are widely used for depositing cobalt thin films in advanced semiconductor interconnects, magnetic recording media, and various electronic devices.
Cobalt offers excellent thermal and electrical conductivity, good corrosion resistance, and superior magnetic properties. High purity cobalt targets (4N) ensure minimal contamination and stable film properties, which are critical for advanced semiconductor manufacturing processes such as cobalt interconnect layers and barrier/seed layers.
High purity cobalt sputtering targets are available in custom sizes and shapes, with surface finishes including machined and polished. Target bonding services are available for copper or titanium backing plates to improve thermal management during sputtering. Typical applications include semiconductor interconnects, magnetic thin films, and electronic devices.
Features Of High Purity Cobalt Sputtering Target
High Purity: 99.99% (4N) purity, ensuring minimal contamination and stable film properties.
Excellent Film Uniformity: High density and fine grain structure provide uniform sputtering and film thickness.
Low Particle Generation: Advanced melting and machining processes minimize particle generation during sputtering.
Good Thermal Conductivity: Cobalt offers excellent thermal conductivity, reducing thermal stress during sputtering.
Superior Magnetic Properties: Ideal for magnetic thin film applications.
Customizable Dimensions: Custom sizes and shapes available.
Target Bonding Services: Copper or titanium backing plates available for improved thermal management.
Surface Finishes: Machined, polished.
Specifications Of High Purity Cobalt Sputtering Target
| Parameter | Specification |
|---|---|
| Material | Cobalt (Co) |
| Purity | ≥99.99% (4N) |
| Density | 8.9 g/cm³ |
| Melting Point | 1495°C |
| Grain Size | ≤ 50 μm (fine grain) |
| Target Thickness | Customizable |
| Target Diameter | Customizable |
| Backing Plate | Copper or titanium (bonding service available) |
| Surface Finish | Machined, polished |
Chemical Composition (Typical):
| Element | Content |
|---|---|
| Co | ≥ 99.99% |
| Ni | ≤ 0.005% |
| Fe | ≤ 0.003% |
| Cu | ≤ 0.001% |
| C | ≤ 0.001% |
| S | ≤ 0.0005% |
| O | ≤ 0.003% |